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ACTE INDUSTRYCORPORATE HEADQUARTERS
Our COM Express Compact module with type 6 pin-out fully complies with the PICMG (PCI Industrial Computer Manufactures Group) COM.0 R2.1 specification. The CPU module uses the new 14nm leading-edge low-power SoC with a size of 95 x 95 mm COM Express form factor. It features a 15 watt thermal design power (TDP) rating and is equipped with a power-saving ULV-SoC. It supports up to 8GB dual channel DDR3L 1866 non-ECC, with higher memory bandwidth for better performance. Compared with previous platforms, it has a +45% graphics performance, and +30% CPU performance enhancements. It is equipped with an integrated Intel Gen 9 low power (LP) graphics and media encode decode engine, supplying up to three independently operated 4K displays. It also supports hardware accelerated video decoding for HEVC, H.264, MVC, VP8, VP9, MPEG2, VC-1, WMV9, JPEG and MJPEG. I/O includes 5 x PCIe x1, 2 x SATA Gen3.1, 2 x USB 3.0, and 8 x USB 2.0. In addition, it adds one mounting hole around the processor to strengthen the board structure to avoid board bending.
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